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Processing

This series includes the titles listed below.

Available:

• Fabrication of GaAs Devices
  A. Baca and C. Ashby
• MEMS Packaging
  Tai-Ran Hsu
• Process Technology for SiC Devices
  C.-M. Zetterling (Ed.)
• Silicide Technology for Integrated Circuits
  L.J. Chen (Ed)
• Silicon Wafer Bonding Technology for VLSI and MEMS Applications
  S.S. Iyer and A.J. Auberton-Herve (Eds.)
• SIMOX
  M. Anc

Prices given are valid for 2007.